Comprehensive Via Properties

Parasitics, Thermal, & Current Limits

PHYSICAL PROPERTIES

Hole Diameter ($d$)
mm
Pad Diameter ($D_1$)
mm
Anti-Pad Diameter ($D_2$)
mm
Via Height/Thickness ($h$)
mm
Plating Thickness ($t$)
μm
Dielectric Constant ($E_r$)

THERMAL & ELECTRICAL ENVIRONMENT

Allowed Temp Rise ($\Delta T$)
°C
Signal Rise Time ($T_r$)
ps
Capacitance ($C$)
0.00 pF
Inductance ($L$)
0.00 nH
Via Impedance ($Z$)
0.0 ohms
Resonant Frequency
0.0 GHz
DC Resistance
0.00 mohms
Plating Cross-Section
0.00 mil²
Max Current Capacity
0.0 A
Thermal Resistance
0.0 °C/W
Step Response Degradation (10-90%)
+0.0 ps

Math & Theory