| Layer Name | Type | H1 (μm) | H2 (μm) | Er | Cu (μm) | Required W | Required S |
|---|
Unlike standard calculators that ask for a trace width and output an impedance, this tool works in reverse. It acts as a multi-layer geometric solver. You select a target impedance (e.g., 90ohms Diff for USB), define the dielectric heights and copper weights of your stackup, and the engine calculates the exact Trace Width ($W$) and Pair Spacing ($S$) required on every single routing layer simultaneously.
Because the standard IPC equations compute impedance from width ($Z = f(W)$), this tool uses a computational binary search (bisection method) to invert the equations and solve for $W$ and $S$ iteratively until the target is hit.
Microstrip (Surface Layers)
Single-Ended:
Differential:
Stripline (Internal Layers)
Single-Ended (where $B = H_1 + H_2 + T$):
Differential:
Note: IPC equations are approximations accurate to ~5-10% in typical ranges. They are excellent for pre-layout planning and stackup design. Final tapeout sign-off should be done in consultation with your manufacturer's 2D field solver (e.g., Polar Instruments or Si8000).